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Teleflex Awarded U.S. Army Grant to Develop Anti-Biofilm Orthopaedic Device

Teleflex was awarded a $2.1 million research grant from the U.S. Army's Telemedicine and Advanced Technology Research Center to support research and development of a surface-modified tibial intramedullary nail that combines Semprus Sustain™ and antimicrobial technologies. Up to an additional $2.46 million in project funding may be provided under the award, at the U.S. Army's discretion. (Source: Teleflex Incorporated)